Blog, Extreme Air Cooling, Thermal
Thermal Convection: A Pillar of Heat Transfer In a majority of thermal management solutions, we use thermal convection as a means to remove heat away from our sensitive components and devices. In the rare case we don’t use convection, it’s because we have...
Blog, Design Engineering, Thermal
All too often, thermal management is considered too late, if at all, in the design process. In the effort to help make you the thermal expert in your office, the Boyd team is always looking for the latest news and how it relates to our world of thermal management. We...
Blog, Extreme Air Cooling, Manufacturing Capabilities, Thermal
Skived Fin Heat Sinks: Singular Piece Solutions Many heat sink designs consist of separate fins and base and are assembled together using an adhesive process to bond the two together. These heat sink assemblies have an added thermal resistance in the form of the...
Blog, Conduction Cooling, Extreme Air Cooling, Thermal
Heat Sink Bases: a Good Foundation for a Great Solution Heat sinks come in all shapes, sizes, styles, and materials. But a common feature with many heat sinks is the base: the part of the heat sink that contacts the device(s) and supports extra surface area, typically...
Blog, Consumer Electronics, Thermal
Applying Thermoelectric Devices in New Ways TEGway ThermoReal is a thermoelectric device embedded controller. TEGway has developed a way to generate a flexible array of miniature thermoelectric devices (TEDs). This flexible array of TEDs is powered in rows. This...
