Boyd was tasked with the following:
• To create a thermal CFD model of the existing product and implement PCB thermal properties.
• Create package level model for all critical components, apply thermal resistances and power.
• Compute internal and external thermal radiation paths. Simulate the baseline case and analyze temperature data, identify hot spots, and explore opportunities for improvements.
• Design heat sink for total power of 45W, to limit the internal enclosure temperature to 85°C with an external ambient of 55°C. (max 30°C rise).
• Optimize the heat sink design including: fin height, spacing, materials, base thickness, manufacturing process, size etc.