Heat Sinks - Maximize thermal performance with minimal mass by using optimized extruded, skived, bonded, brazed, and zipper fin style heat sinks.
Heat Pipes and Vapor Chambers - Boost heat sink performance by distribution heat from the component over the full heat sink base.
Thermal Interface Materials - Reduce temperature drop between electronic components and the thermal solution to maximize thermal solution performance.
Fans and Blowers – Maximize thermal performance by moving air through the heat sink as quietly and efficiently as possible.
HMI: Switches, Displays, and Injection Molded Housings – Unparalleled reliability, dependability, and durability in high moisture environments for a superior operator experience.
Nameplates – Enhance the look of the brans and model in increase brand loyalty and value.
Labels – Custom labels that enable identification, improve safety, and meet agency requirements such as UL and CSA.
Electrical Insulators – Increase dielectric strength between internal electrical components that can lead to device shorting or failure.
Gaskets and O-rings – Protect against harsh liquid, gas, or particle contamination to extend product lifetimes for IP rated products.
Thermal Insulators – Protect against extreme heat and cold for reliable performance for sensitive components on the PCB.
EMI Solutions – Reduce electronic malfunction and improve device and signal reliability on the PCB.
Boyd, Trusted Innovation