How to Seal and Protect Data Centers:
Boyd’s agile manufacturing enables rapid prototyping, faster turnaround and streamlined supply of high efficiency converted advanced materials. One-shot manufacturing and integrated thermal solutions create thinner, denser, higher-performing Enterprise Electronics.
- FR V-0 Front and Back Panel Overlays:
- Custom overlays enable branding with improved safety and enhanced user experience.
- FR V-0 Air andAcoustic Blocker
- Improve air-blocking, thermal management, and acoustic absorption.
- FR V-0 EMI
- Shielding Reduce electronic malfunction and improve device and signal reliability by blocking unwanted external electromagnetic waves.
- FR V-0 Baffles for Air Flow Management and Gap Filling
- After airflow inside the server to efficiently direct it to the appropriate area for cooling.
- FR V-0 Thermal Interface Materials (TIMs)
- Facilitate heat transfer away from sensitive components on the board for improved cooling.
- FR V-0 Air Leak Sealing and Air Gap Filling Foams
- Prevent loss of cool air, fill air gaps, and connect pathways for internal airflow optimization.
- Printed Membrane Switches
- Printed graphic overlay with integrated electronics for HMI applications.
- Electronics and Display Integration
- Integrated solutions and complex functional display assemblies for high end OEMS.
- Enclosure Housing and Environmental Seals
- Ruggedize and protect against harsh vibration and liquid, gas or particle contamination to extend product lifetimes.
- FR V-0 Velcro Cable Management
- Hook and loop straps to fasten cable and/or wires inside the server assembly.
- High Temperature Resistant UL 969 Labels
- Roll labels enable branding with improved safety and an enhanced user experience.
- Custom Made Nameplates
- Durably identify and promote the brand and model.