Electromagnetic Interference (EMI) or Radio Frequency Interference (RFI) cause errors and reduce performance in sensitive communication systems and devices by reducing electronic signal integrity and strength. Extraneous energy waves can enter or exit a device through seams and openings in electronic devices provide avenues which causes inconsistent performance.
Boyd’s LectroShield Fabric-Over-Foams are ideal for applications requiring shielding performance as well as high conformability, compressibility, and cushioning. Boyd’s EMI/RFI Gaskets are designed for electronic devices that need a soft cushion and tight contact with conductivity. Fabric-Over-Foam Gaskets accommodate mechanical tolerance stack up with its compliance and cushioning properties.
Fabric-Over-Foam EMI gaskets offer high conductivity and shielding attenuation and are ideal for applications requiring low compression force. Urethane and Thermoplastic Elastomer (TPE) cores provide low compression set ensuring long term reliability of gasket performance. Foam cores are adhered to the conductive fabric by hot melting. Metallized fabrics are available in Nickel/Copper (Ni/Cu) and Tin/Copper (Sn/Cu) to ensure galvanic compatibility with a wide variety of materials.
Abrasion resistant metallized fabrics show virtually no degradation in shielding performance after 1,000,000 cycles (ASTMD3886). Fabric-Over-Foam profiles are available in a UL 94 V0 flame retardant version and offer high abrasion and shear resistance.
EMI Technical Paper
LectroShield Fabric-Over-Foam Catalog
Considerations for EMI & Choosing the Right Solution
Fabric-Over-Foam EMI/RFI Gaskets can be cut to specific lengths, kiss-cut on release liner, or assembled for frame configurations. Typical EMI gasket applications include shielding or grounding of computer and telecommunications equipment seams and apertures.
Utilize Boyd’s technical materials and design expertise, global supply chain management, and quality manufacturing, to get the best-cost, engineered EMI/RFI gasketing solution for your application. With our broad range of capabilities, we can help integrate you EMI/RFI management solution into a multi-functional assembly, reducing your design complexity. Our decades of engineering expertise in conjunction with your team help enable you to meet your EMI/RFI challenges in a cost-effective and integrated way.
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