Boyd to Exhibit at Supercomputing 2025 in St. Louis, Missouri

See Boyd’s Innovations in Liquid Cooling for High-Performance Computing and AI Systems

Boca Raton, FL – November 13th, 2025 – Boyd, a leader in liquid cooling systems for high performance computing (HPC) and AI data centers, will showcase its latest innovations designed to support pioneering HPC and AI systems at Supercomputing 2025 (SC25), in St. Louis, Missouri from November 16th – 21st. Visit Boyd at booth #4300 to learn more about Boyd’s liquid cooling system technologies and to see the Project OMNICOOL liquid cooling demonstration.

Boyd’s experts will be available to discuss its Chip to Ambient™ thermal circuit, which introduces an innovative approach to optimize liquid cooling system energy consumption in future AI factories. This cooling approach dynamically aligns real-time power usage with computational output with an intelligent cooling system that cools all AI IT and power delivery components, from the chip to the final heat exchange point outside the facility, through a fully integrated technical and facility cooling infrastructure. A unique “liquid communication layer” enables seamless interaction between thermal system elements, allowing for balanced demand loads and predictive planning. This highly efficient, reliable, and space-saving cooling solution adapts to variable IT demands while minimizing capital expenditures.

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“Boyd is proud to participate in Supercomputing 2025, a premier global event that brings together the brightest minds in high-performance computing,” said Jerry Toth, Boyd Chief Technology Officer. “As HPC systems grow in complexity and power density, thermal management is even more critical to performance and reliability. Boyd is helping data center and HPC leaders boost performance, efficiency, and uptime with advanced designs and high-quality manufacturing.”

Boyd experts will also be on site to discuss liquid cooling solutions for next generation data centers and AI processing as well as the Project OMNICOOL liquid cooling demonstration. This demo represents collaborative contribution to the ARPA-E COOLERCHIPS Project. Boyd’s coolant distribution units (CDUs), liquid cooling loops, and rack manifolds meet the quality, performance, and reliability requirements of the most demanding IT equipment. These solutions are backed by Boyd’s 40+ years of data center cooling experience, produced by high-capacity global manufacturing facilities, and supported by global service teams with regional availability in North America, Europe, and Asia Pacific.

Visit Boyd at booth #4300.

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