Boyd Corporation has a long history of developing, designing, testing, optimizing, and fabricating reliable high-performance cooling solutions across all industries. Through consistent innovation in engineering and manufacturing, Boyd provides optimized, cost-efficient thermal solutions and systems utilizing the largest range of traditional and advanced cooling technologies.
Boyd’s thermal management solutions enable our customers to:
Cooler devices can perform faster, meaning product designers can increase computational processing speed or electronic switching speed to decrease battery charge times or energy conversion.
Decrease the weight and volume of a thermal solution for the same device output, leaving room for more functionality or a smaller product.
Excessive heat can wear out materials, including silicon chip processors and lithium ion (Li-Ion) batteries, so keeping your product cool will keep it running longer and safer.
Thermal Management is the process of controlling the heat generated by products typically by cooling them with liquid systems, two-phase assemblies, air cooling, or conduction solutions. In most cases, thermal energy is removed from heat sources and dissipated into ambient air.
Nearly every industry and product employ high power devices or electronics and as devices get smarter and more connected, they use more power in smaller volumes. This trend concentrates heat and is a limiting factor to faster processing, higher battery capacity.
Boyd’s expertise with a broad range technologies enables us select the best fit cooling solution to your application requirements. Boyd’s solutions extend from traditional and advanced air cooling and liquid cooling systems and heat exchangers, to more advanced conduction cooling and two phase heat transfer.
Apply the high heat capacity of liquid cooling in liquid systems, chillers, coolant distribution units (CDUs), cold plates, and heat exchangers.
Spread, transport, and dissipate high heat loads reliably with two-phase vapor chambers, thermosiphon systems, and heat pipe assemblies.
Cool your products and systems with cost-effective zipper fin assemblies, extruded heat sinks, double width double inlet (DWDI) blowers, or axial fans.
Spread high density heat loads with graphite heat spreaders, encapsulated graphite chassis and enclosures, and thermal interface material.
Complete your thermal management solution with heat pipes, hardware, thermal interface materials, and insulation.
Find hundreds of our standard components for purchase at our Authorized Distributors.
Shorten your design cycles with accurate performance predictions from our decades of two-phase, liquid, and air cooling expertise in Aavid Smart CFD and Aavid Genie.
Have questions? We're ready to help!