Home » Blog » Thermal » Page 15
Thermal
Thermal
Bonded Fin Heat Sink: What is it and how does it compare to other heat sinks? Genie has a bonded fin heat sink as one of the options available to you in the Technology Matrix. For those unfamiliar to them, a bonded fin heat sink consists of 3 main parts: a base with...
Thermal
Ducted Versus Bypass Flow Heat sink performance is impacted directly by how air flows through or around the fins of the heat sink. Ducting helps focus air flow through the fins, maximizing how much of the fluid is in direct contact with the fin surface area. This...
Thermal
Summer is upon us and it brings some sweltering hot days with it. This is a great time of year to consider your next product and the thermal conditions it may encounter. It also puts us into a mindset where we experience the hotter temperatures our end users may...
Thermal
We’re a Big Fan of Forced Convection In the thermal management industry, we are highly concerned with the convection type. Is it natural or is it forced convection? The answer to that question makes a big difference when it comes to designing a cooling solution....
Thermal
Space: the Final Frontier In the “Project Conditions” page of Boyd Genie, there is a box that asks you the “Working Envelope.” This term refers to the heat sink design volume. Think of this as the volume you have available for your heat sink in...
Thermal
In an earlier blog post, we discuss the importance of user product acceptance. We examined another gaming laptop product review that focused heavily on the thermal management solution and its shortcomings. The high performance laptop heated up in uncomfortable areas...
