Boyd More than Doubles Liquid Cooling Manufacturing Capacity in Mexico, Boosting Production for AI Infrastructure, Hyperscale and Colocation Data Centers

Boyd Continues to Expand High Volume Manufacturing Capacity for Liquid Cooled Solutions in Next-Gen Data Centers

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Boca Raton, FL – February 5, 2025 — Boyd is excited to announce its growing capacity for AI data center liquid cooling system production with the expansion of its design and manufacturing facility in Juarez, Mexico. To scale with growing hyperscaler, colocation, and enterprise AI data center installation demand, Boyd’s Juarez thermal campus is being expanded to approximately 460,000 square feet, up from its current footprint of 217,000 square feet.
Boyd Juarez engineering and operational staff have extensive experience in designing, manufacturing, and testing liquid cooling systems, specializing in coolant distribution units (CDUs) ranging from 0.5 megawatts to 5 megawatts with a technology roadmap to deliver even higher performance levels for future needs. The expansion increases our capacity to globally scale liquid cooled solutions like CDUs, direct-to-chip liquid cold plates, cooling loops, and in-rack manifolds, which solve customers’ increasing reliability, performance, and volume demands in rapidly expanding AI data centers.
“We anticipate AI data center customer needs and market dynamics allowing continuous alignment of our operations, manufacturing capacity, and technology investments for cooling up to 5 MW and beyond,” said David Huang, Boyd President, Thermal Solutions Division. “Global customers depend on Boyd Juarez operations to deliver scalability, performance, and flexibility as they build data center infrastructure today and in the future.”
The Juarez facility includes on-site design, testing, and manufacturing engineering teams, supported by a strong supply chain architecture and key global vendor partnerships. Boyd Juarez’s highly responsive organization ensures Boyd can effectively support customers’ growth plans and accelerate speed to market for high-volume, high-performance AI data center cooling.

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