Boyd Blog

Maximizing AI Data Center Cooling Efficiency with Boyd and NVIDIA Solutions

Scaling AI Data Centers: Overcoming Cooling Challenges AI data centers are scaling rapidly to meet the intense compute demands of generative models and large language model inference. These workloads, often accelerated by NVIDIA’s latest GPU architectures, drive...

Search the Boyd Blog

Benefits of Battery Immersion Cooling for EV and Data Centers

Beyond Conventional Cooling: Immersion TechnologyElectric vehicles (EVs) and data centers demand...

What is Air Gap Bonding?

As performance requirements for integrated touchscreens and displays continue to evolve,...

Thermal Management in Artificial Intelligence

Thermal Management in Artificial Intelligence

May 2, 2023 | Autonomous Compute and Artificial Intelligence, Blog, Cloud Data Center, Thermal

As technology continues to evolve, more companies leverage Artificial Intelligence (AI) to improve existing offerings...

Introduction to Thermal Management: Keeping Devices Cool

Introduction to Thermal Management: Keeping Devices Cool

May 1, 2023 | Blog, Conduction Cooling, Extreme Air Cooling, Liquid Cooling, Thermal, Two Phase Cooling

The latest electrification trends drive products to contain more powerful and compact electrical components, which...

Tape Backing or Carrier Types

Tape Backing or Carrier Types

Mar 24, 2023 | Blog, Bonding and Adhesive Systems

What are the different adhesive tape carrier material types? Adhesive tape backing materials are the foundation of...

Tape Construction Types

Tape Construction Types

Mar 24, 2023 | Blog, Bonding and Adhesive Systems, Engineered Materials

What are the different adhesive tape types? There are three main types of adhesive tape constructions: transfer tapes,...

« Older Entries

Next Entries »

Have questions? We’re ready to help!