Accelerate Thermal Modeling

Quickly build your heat sink by selecting from preconfigured heat sink types such as extruded, bonded, folded, zipper, or pin fins. All dimensions of the heat sink can be parameterized to evaluate different options efficiently.

Manufacturing effects such as bonding thermal resistance can be selected from a library and defined in one place. Boyd SmartCFD determines all the interfaces between the base and fins and applies the thermal bonding resistance.

Scripting and parameterization of liquid cold plate geometries in Boyd SmartCFD accelerate modelling and design exploration of Liquid Cold Plates.

Boyd SmartCFD provides full 3D CFD analysis for all types of Liquid Cold Plate designs to analyze flow, pressure drop, and thermal properties. Boyd SmartCFD’s Trials feature automates the characterization of Liquid Cold Plates to produce F-J curve reduced order models (ROMs). For example, Liquid Cold Plate ROMs are utilized in the Network solver to look at full fluid systems with pumps, pipes, connectors, and valves.

Boyd SmartCFD streamlines the analysis of large complex air/air, air/fluid, and fluid/fluid heat exchangers. This is accomplished through the Hybrid Solver approach which uses the CFD solver in the solid domain and the System Solver in the fluid domain.