Device Level Cooling

Efficient, reliable cooling of today’s semiconductors, with their steadily increasing heat loads and heat fluxes, requires innovative and compact thermal solutions that go beyond traditional electronic heat sinks and enable your products to perform at higher levels. Aavid, Thermal Division of Boyd Corporation, offers thousands of heat sink and cooling solution options for lightweight, reliable, device-specific thermal management. Solutions are engineered and optimized for specific package types or devices to better cool your board or product. Choose your device below to browse options or request a quote.

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Device Types Include

Larger Device Solutions include:

-DC to DC Converters
-IGBTs
-LEDs
-Electrolytic Capacitors
-Microprocessors

Advanced Technologies for Higher Heat Loads:

- Heat Pipes/ Vapor Chambers/ Loop Heat Pipes - As passive thermal technologies, these two-phase heat transfer devices offer the benefits of no moving parts, reliable operation, low mass and weight, shock and vibration resistance and low mechanical loading. They operate by spreading heat out or moving it to a remote location, for optimum thermal management.

 

- Fans & Air Movers - Increase the efficiency of your device level cooling through forced convection utilizing fans, blowers, or Aavid’s patented jet technology.

 

- Advanced Solid Conduction - k-Core® encapsulated APG (Annealed Pyrolytic Graphite) gives you up to five times the thermal conductivity of aluminum or copper, plus low mass, in an easily-installed, drop-in replacement for other solid conductors like aluminum and copper.

 

- Liquid Cooling - With high thermal performance, no maintenance and lower airflow requirements, these technologies provide multi-component cooling. This reduces system noise and energy consumption levels by allowing the use of smaller fans or air movers.