Aavid’s passive heat pipe computer microprocessor cooling technologies include:
•Vapor Chamber Heat Sink Assemblies
for superior, low profile three-dimensional heat spreading for applications such as 1U and blade servers with limited height above the processor and high heat flux conditions, which require the most efficient possible heat sink. Vapor chamber heat sinks can provide greater than 20% reduction over copper based in instances where the ratio of heat sink base area to die surface area is larger than 20:1.
•Embedded Heat Pipe Heat Sink Assemblies
enable heat spreading in server applications with moderate heat fluxes (<100 W/cm2), the need to improve all metal heat sink efficiency, and potential need to move heat from electronic components with various heights on the printed circuit board.
•Tower Heat Sink Assemblies offer a direct interface to the microprocessor to minimize thermal resistance for heat removal and provide “vertical” heat spreading. These Heat Sink Assemblies are for microprocessor cooling applications such as 2U or 3U servers with high heat loads, available vertical height above the microprocessor processor, and high heat flux conditions (>75 W/cm2).
•Vapor Tower Heat Sink Assemblies combine vapor chamber low profile, three-dimensional heat spreading technology with the “vertical” heat spreading. Vapor Tower technology for microprocessor cooling applications such as 2U or 3U servers with high heat loads, a need for significant heat spreading, available vertical height above the processor, and high heat flux conditions (>100 W/cm2).
For applications where forced air cooling is inadequate (extremely high heat loads and/or multiple heat sources), Aavid’s active pumped Liquid Cooling System technology may be the solution. This technology includes several cold plate technologies, including microchannel or vertical fin and powder metal, that interact with a thermally conductive liquid, delivered via a pump, to remove heat from the processor.