Thermal Solutions for Enterprise Computing

Semiconductor thermal management solutions for high-performance multi-processor servers, desktops and notebooks are becoming more crucial as microprocessor sizes shrink and thermal loads rise.

For servers, desktop computers and notebooks, Aavid meets the challenges of cooling today’s computing systems — and tomorrow’s — more efficiently, more cost-effectively and with a smaller overall footprint, through a variety of innovative products.

Advantages include:
•Lower processor junction temperatures for longer product life

•Improved microprocessor reliability and speed

•Reduced overall energy consumption through reduced airflow requirements

Aavid offers a variety of thermal technologies to maintain microprocessor junction and case temperatures below maximum conditions while heat loads continue to increase. Aavid has developed solutions with thermal resistances, Rth or Φ (°C/W) measured from heat sink to local internal ambient below 0.06°C/W at microprocessor powers exceeding 300 W.

Aavid’s passive heat pipe computer microprocessor cooling technologies include:
Vapor Chamber Heat Sink Assemblies for superior, low profile three-dimensional heat spreading for applications such as 1U and blade servers with limited height above the processor and high heat flux conditions, which require the most efficient possible heat sink. Vapor chamber heat sinks can provide greater than 20% reduction over copper based in instances where the ratio of heat sink base area to die surface area is larger than 20:1.

Embedded Heat Pipe Heat Sink Assemblies enable heat spreading in server applications with moderate heat fluxes (<100 W/cm2), the need to improve all metal heat sink efficiency, and potential need to move heat from electronic components with various heights on the printed circuit board.

•Tower Heat Sink Assemblies offer a direct interface to the microprocessor to minimize thermal resistance for heat removal and provide “vertical” heat spreading. These Heat Sink Assemblies are for microprocessor cooling applications such as 2U or 3U servers with high heat loads, available vertical height above the microprocessor processor, and high heat flux conditions (>75 W/cm2).

•Vapor Tower Heat Sink Assemblies combine vapor chamber low profile, three-dimensional heat spreading technology with the “vertical” heat spreading. Vapor Tower technology for microprocessor cooling applications such as 2U or 3U servers with high heat loads, a need for significant heat spreading, available vertical height above the processor, and high heat flux conditions (>100 W/cm2).

For applications where forced air cooling is inadequate (extremely high heat loads and/or multiple heat sources), Aavid’s active pumped Liquid Cooling System technology may be the solution. This technology includes several cold plate technologies, including microchannel or vertical fin and powder metal, that interact with a thermally conductive liquid, delivered via a pump, to remove heat from the processor.


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