Thermal & Converting Glossary
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Pressure Sensitive Adhesives (PSA), double and single–sided, acrylate, rubber or silicone based, carrier-free transfer adhesive or with carrier material, such as foam, non-wovens, foil or fabric.
Medical: Functional products for In Vitro Diagnostics (IVD), cosmetics, wound care and disposables.
Alkali Metal Heat Pipe
Heat pipe that uses alkali metal as working fluid. Alkali Metal Heat Pipes are typically used for high temperature (300°C to 2,000°C) applications.
Aluminum silicon carbide.
Advanced pyrolytic graphite.
Axially-Grooved Heat Pipe
Heat pipe that uses extruded axial grooves in the internal wall as the wick material.
Breathable PU film
Moisture-regulating germ barrier for wound care products.
Command, Control, Communications, Computers.
Computer-Aided-Design software programs.
Capillary Pumped Loop
Capillary action generated by fine porous wick material located only in the evaporator provides pressure head needed to circulate fluid through entire system. Vapor and liquid move in the same direction in a loop, rather than in counterflow, as in conventional heat pipes.
Cellular rubber and foam rubber, Polyethylene (XLPE), Polyimide (PI), Ethylene Propylene Diene Monomer (EPDM), Polyvinyl Chloride (PVC) and Polyurethane (PU) foams, silicone foam, blended cellular sponge/rubber formulations.
A plate used to transfer heat and cool electronics. See Liquid Cold Plate.
Multi-layer insulation material, polyester film, non-woven polyester or chipboard combinations, chipboard-PET-chipboard.
Commercial Off The Shelf.
Coefficient of Thermal Expansion.
Coefficient of Thermal Expansion (CTE) matching involves harmonizing the materials of a heat source and heat sink to ensure that as temperature changes the devices expand and contract such that mechanical stresses are not induced to cause failure.
Delta T or dT
Temperature difference between hot spot and heat sink.
Elastomers & rubber
Ethylene Propylene Diene Monomer (EPDM), Nitrile Butadiene Rubber (NBR, Buna-N), Natural Rubber (NR), Styrene-Butadiene Rubber (SBR), Neoprene Rubber (CR), Fluoroelastomers (FKM), Silicone (Viton), Masticated Rubber.
Embedded Heat Pipe
Heat pipe that is integrated into a solid material such as copper or aluminum to enhance the effective thermal conductivity of the solid material.
EMI/RFI shielding material
BOYD LECTROSHIELD - Fabric-Over-Foam (FOF), gasket material, electrically conductive adhesive tape and coated polyester fabric.
BOYD LECTROSHIELD - Conductive Foams
BOYD LECTROSHIELD - EMI Absorbers
Filter materials, reticulated foam, non-wovens, felts.
Non-woven: Inexpensive, disposable product with absorbent properties.
Silver fabrics: Germicidal, anti-microbial effect in wound care and cosmetic products.
Finite Element Method.
Flexible Heat Pipe
Heat pipe that includes a flexible section between the evaporator and condenser. The flexible section can be made of a bellows or other flexible structure.
Heat load per unit area (W/cm2).
A system that combines hydrogen and oxygen to produce electricity.
A mixture of water and propylene glycol, an antifreeze that lowers the freezing point of water.
Graded Wick Structure
A wick structure that has spatially varying wick properties.
TransTherm silicone and silicone free insulating foil, gap fillers, phase change material and adhesive tapes; flexible graphite solutions.
A device built for efficient heat transfer from one medium such as air or liquid to another, whether the media are separated by a solid wall so that they never mix, or the media are in direct contact. Heat exchangers are typically used for enclosure cooling and can be of the following type: air-to-air, liquid-to-air, or liquid-to-liquid.
Heat Pipe Heat Spreader
A plate that utilizes heat pipes to improve thermal conductivity and to move heat and cool electronics. Heat pipe spreaders are passive and increase the conductivity of the base material significantly.
A device that transports heat through the evaporation and condensation of a working fluid (i.e., two-phase cooling). Heat pipes are devices that have an extremely high effective thermal conductivity, typically 10 to 10,000 times more conductive than solid materials.
A heat sink (or heatsink) is an environment or object that absorbs and dissipates heat from another object using thermal contact (either direct or radiant). Heat sinks are used in a wide range of applications wherever efficient heat dissipation is required; major examples include refrigeration, heat engines, cooling electronic devices, and lasers.
A heat spreader is a device having high thermal conductivity to move heat from a concentrated or high heat flux source (high heat flow per unit area), to a heat exchanger with a larger cross sectional area, surface area and volume. Heat spreaders can be solid conductors like copper or pyrolytic graphite, or they can be a two-phase device like heat pipes and vapor chamber heat pipes.
High passenger volume multi-car subway system.
High-pressure gasket material
Non-asbestos fibre, Graphite, Aramid fibers with a nitrile binder
Engine drives a generator for electric propulsion.
Hydrogels & Hydrocolloids
Skin-friendly adhesive for stoma products or electrodes.
Hydrophilic Polyurethane (PU) Foam
Wound care products for the optimizing of the wound environment.
Insulated Gate Bipolar Transistor.
Isothermal Furnace Liner (IFL)
An annular heat pipe that is typically operating at high temperature (>300°C) to keep the hot zone of a furnace at uniform temperature or isothermal. IFLs typically utilize alkali metals such as cesium, potassium, sodium or NaK as the working fluid. Typical applications include crystal growth, temperature calibration, etc.
k-Core® with carbon fiber composite encapsulant.
Light Airborne Multipurpose System.
Street level two-car transit rail systems.
Liquid Cold Plate
A plate that utilizes pumped liquid to move heat and cool electronics. Liquid cold plates are often machined and/or vacuum brazed with connectors for the liquid inlet/outlet ports.
Liquid Cooling System
A system used to remove heat by circulating a single-phase liquid using a pump and liquid-to-air heat exchanger. As opposed to air cooling, a single-phase liquid is used as the medium for transferring the heat. A water-based coolant is commonly used for cooling electronics, internal combustion engines in automobiles and large electrical generators.
Loop Heat Pipe
A two-phase heat transfer device that uses capillary action to remove heat from a source and passively move it to a condenser or radiator. LHPs are similar to CPLs but have improved startup characteristics.
A wick that is constructed of nano-sized structures for improved capillary pressure generation.
For more information on the various O-Ring compounds visit our O-Rings website here.
Thermal expansion in parts per million per K (e.g. micron/meter/Kelvin).
A highly purified ethylene derivative used as a cooling medium in liquid cooling systems.
Integrated modules of power switching devices.
Shock caused by explosive devices for space deployment.
Mounting a device on shock absorbers to limit loading.
Thermal mass or masses at the edge of thermal cores or spreaders.
Moving heat from a concentrated heat source to a location where that heat can be dissipated and managed more effectively.
Silicon Carbide device.
Thermal resistance path between heat load and sink.
A plate to cool electronics.
Plastics and foils, such as: Acrylonitrile Butadiene Styrene (ABS), Hard Polyvinyl Chloride (HPVC), Polyethylene (PE), Polycarbonate (PC), Polyamide (PA), Polyethylene Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polyoxymethylene (POM), Polypropylene (PP), Polystyrene (PS), Polytetrafluoroethylene (PTFE), Polyurethane (PU), Polyimide (PI), Polyether Ether Ketone (PEEK), Polyethylene Naphthalate (PEN).
Phenolic resin paper laminate, fabric-base laminate, polyester glass mat, vulcanized fibre.
A heat pipe that relies on gravitational forces to return the liquid back to the evaporator. Thermosiphons typically have no wick.
Thin Vapor Chamber
A vapor chamber with a thickness less than 3mm or 0.118 inches, basically the thickness of a credit card. See vapor chamber.
Transmitted/Receiver module for phased arrays.
TransTherm™ Catalog [PDF]
TransTherm™ Phase Change Material [PDF]
TransTherm™ Gap Fillers Material [PDF]
TransTherm™ Thermal Conductive Adhesive Material [PDF]
TransTherm™ Silicone & Silicone-Free Thermal Pads Material [PDF]
A flat or planar heat pipe that allows three-dimensional spreading of heat with an extremely high thermal conductivity. Vapor chambers are typically used as the base of a heat sink. Vapor chambers deliver higher thermal performance than a traditional heat sink by alleviating spreading resistance found in solid heat sink construction. Vapor chambers are typically constructed of stamped or machined plates with a hollow center for vapor flow.
A vapor tower heat pipe is a combination of a vapor chamber and vertical heat pipe. A vapor tower not only can spread heat like a vapor chamber in the x-y plane, but also transfers heat in the z-plane to heights much greater than 12mm or 0.5 inches.
Variable Conductance Heat Pipe (VCHP)
A variable conductance heat pipe is a heat pipe with a fixed charge of inert gas such as Argon or Helium used in applications requiring tight temperature control. Variable conductance heat pipes employ a large reservoir of inert non-condensable gas attached to the condensing section. The gas partially occupies the condenser as well, so changes in the pressure or temperature of the gas cause a change in its volume, allowing more or less condenser area to be active; this has a regulating effect on the operating temperature of the VCHP.
Standard commercial card format - IEEE 1101.2.
SI units for conductivity Watts/(meter·Kelvin).
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