With electronic devices and high performance products processing more in smaller volumes, we use heat spreading to manage high heat density sources. By enabling heat to access more surface area of a heat sink, chassis, or enclosure, heat spreading helps keep localized temperatures within device operating limits, maintains functionality and prolongs product lifetimes.
Learn more about how these heat spreading technologies work. Compare performance levels of various heat spreading methodologies to aid in selecting the right technology for your application by viewing the resources below
Boyd has several methods for effective heat spreading, including rapid heat transfer with two phase components like vapor chambers and heat pipes or high conductivity graphite. Our expertise in these technologies enables us to embed these heat spreading methods into your solution to enhance the performance of your thermal management solution.
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