Ultra-Thin Titanium Vapor Chambers


This paper discusses two-phase technologies and how advancements in vapor chambers, specifically the development of Ultra-Thin Titanium Vapor Chambers, are enabling the next generations of mobile and wearable devices. Currently these technologies offer a significant advantage in performance and user experience. However, with the increasingly rapid evolution of high performing mobile electronics, Titanium solutions and ultra-thin vapor chambers may eventually be the new standard solutions for cooling these devices. Utilizing Boyd Corporation’s decades of expertise and experience in two phase and ultra-thin cooling technologies, this paper will provide an outline for the future use of Titanium Vapor Chambers for maximum performance and design flexibility.

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