Thermal Interface Materials for Next-Generation Electronics

Overview

Overheating is one of the leading causes of electronic product failure and to overcome thermal limitations of next-generation electronics, design engineers require advanced materials and highly customized solutions. Boyd and 3M™ combine their knowledge expertise in electronics systems to help empower the next generation of innovation. In this technical paper, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat in the next-generation of electronics.

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