Global electronification, smart technologies and technology reliance continue to rise, pushing engineers to develop more powerful chips and data technologies. One of the most significant barriers to technological advancement is managing the excess heat generated by the increase in data processing and storage as well as power generation and supply. This is true across all major industries ranging from Enterprise, 5G, and Telecom to Medical, Transportation, Energy Storage, and Industrial Automation.
New, higher power applications require more efficient cooling for high heat loads in compact volumes, leading engineers to turn to liquid solutions. Liquid has the capacity to transfer heat up to 4X higher than the capacity of forced air of the same mass. This enables improved heat transfer and higher thermal performance with increased design flexibility and scalability.
A liquid cooled system is a hydraulic circuit that typically consists of a cold plate that interfaces with a heat source in a device, hoses and pumps that circulate fluid through the system, and a heat exchanger that rejects heat into the ambient environment. These integrated systems provide highly efficient cooling capable of keeping high power applications running reliably at peak performance; however, there are some limitations.