Video conferencing is becoming an increasingly popular way for people to connect, and has evolved significantly in the past few years. In the past the goal of videoconferencing was merely “seeing there.” Now the challenge of telepresence is to create an experience of “being there.” This causes significant hardware and software challenges for engineering teams who must deliver this experience under budget and on schedule.
Array Telepresence recently introduced the Equal-i Technology that consists of patented image improvement algorithms, cameras, and image processors. These together provide an improved immersive environment at low cost with the use the existing videoconferencing codec. At the time they engaged the services of Boyd, they had completed the industrial, electrical, and mechanical design of the Equal-i 2S Image Processor, and were in the stage of final prototype testing. During this testing stage they discovered that a few critical components inside the device were exceeding their maximum recommended operating temperatures.
As the overall design of the device was completed and mature Array was looking for solutions that can be easily implemented with minimal changes in existing design. Most importantly, they did not want to delay their ship date.
To resolve the thermal issue quickly and efficiently they approached Boyd for thermal review and testing.
