Boyd Genie gives the option of adding embedded heat pipes into the base of your heat sink. Genie takes your device layout into account when determining heat pipe placement. This method approximates what Boyd Engineers would do, which is to focus heat spreading at your heat sources.
Boyd Genie’s parent software, Boyd SmartCFD, can implement more complex swept heat pipe geometry which reflects how we can apply heat pipes in the real world. To keep Boyd Genie fast and simple, it can only insert straight heat pipes that extend from one end of the base to the other.
In case you’re looking for more uniform spreading, we can simulate a vapor chamber in Boyd Genie by applying a Uniform Heat Load. This way you can conduct a rough comparison to assess if your application requires heat pipes or vapor chambers.
Otherwise, there are 4 different ways Boyd Genie will place heat pipes in your base depending on the number of devices and number of heat pipes you include in the base.