LectroShield Fabric-Over-Foam EMI & RFI Gasketing

Increase airflow and heat transfer

Back to Insulation & Shielding

LectroShield Fabric-Over-Foam EMI & RFI Gasketing

Product Details   Related Products

Electromagnetic Interference (EMI) or Radio Frequency Interference (RFI) cause errors and reduce performance in sensitive communication systems and devices by reducing electronic signal integrity and strength. Extraneous energy waves can enter or exit a device through seams and openings in electronic devices provide avenues which causes inconsistent performance.

Boyd’s LectroShield Fabric-Over-Foams are ideal for applications requiring shielding performance as well as high conformability, compressibility, and cushioning. Boyd’s EMI/RFI Gaskets are designed for electronic devices that need a soft cushion and tight contact with conductivity. Fabric-Over-Foam Gaskets accommodate mechanical tolerance stack up with its compliance and cushioning properties.

Fabric-Over-Foam EMI gaskets offer high conductivity and shielding attenuation and are ideal for applications requiring low compression force. Urethane and Thermoplastic Elastomer (TPE) cores provide low compression set ensuring long term reliability of gasket performance. Foam cores are adhered to the conductive fabric by hot melting. Metallized fabrics are available in Nickel/Copper (Ni/Cu) and Tin/Copper (Sn/Cu) to ensure galvanic compatibility with a wide variety of materials.

Abrasion resistant metallized fabrics show virtually no degradation in shielding performance after 1,000,000 cycles (ASTMD3886). Fabric-Over-Foam profiles are available in a UL 94 V0 flame retardant version and offer high abrasion and shear resistance.

Fabric-Over-Foam EMI/RFI Gaskets can be cut to specific lengths, kiss-cut on release liner, or assembled for frame configurations. Typical EMI gasket applications include shielding or grounding of computer and telecommunications equipment seams and apertures.

Utilize Boyd’s technical materials and design expertise, global supply chain management, and quality manufacturing, to get the best-cost, engineered EMI/RFI gasketing solution for your application. With our broad range of capabilities, we can help integrate you EMI/RFI management solution into a multi-functional assembly, reducing your design complexity. Our decades of engineering expertise in conjunction with your team help enable you to meet your EMI/RFI challenges in a cost-effective and integrated way.


Product Details

LectroShield Fabric-Over-Foam EMI & RFI Gasket Materials:

  • Fabric-Over-Foam:
    • Cores:
      • Urethane
      • Thermoplastic Elastomer (TPE)
    • Fabrics:
      • Nickel/Copper (Ni/Cu)
      • Tin/Copper (Sn/Cu)
  • Options:
    • Pressure Sensitive Adhesive
      • Non-conductive Tapes
      • Conductive Tapes
      • Non-Flammable Adhesive Tapes
    • Fire Retardance (UL94 V0 or UL94 HB)


LectroShield Fabric-Over-Foam EMI & RFI Gasket Solutions

  • Ideal for shielding or grounding telecommunications equipment seams and apertures
  • Used for EMI/RFI Management in environments with high electronics density like data centers
  • Integrated with a pressure sensitive adhesive and release liner can enable faster assembly and reduce production time and costs.