Thermal solutions recommended for cooling Intel® Xeon® processor in a FCLGA3647 package*. Product family includes heat sinks engineered for 1U or 2U applications with either low impedance or high power dissipation. For use in the following processors:
Fabrication options include extruded and zipper fin types and integrated heat pipes and copper plates for high performance cooling in a smaller form factor. Heat sinks are ready to mount and come with thermal grease formulated for Intel® applications and grease shield.
*Intel and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
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