As electronic devices become an ever increasing part of our daily lives through further integration into the products that we regularly use, OEMs’ challenges associated with advancing complexities and miniaturization of technology brings new power consumption, heat, thermal design and thermal engineering challenges. The impact of “The Internet of Things” further integrates high performance electronic devices into both traditional and non-traditional applications at exponential rates, with the expectation that these devices are higher powered, smaller, streamlined and efficient with vibrant displays and trusted performance. Heat management, effective thermal conductivity and thermal management solutions become a serious bottleneck to device evolution.
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